Discussion on the binding technology of the most p

2022-08-11
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Discussion on the binding process of sticking books with hot melt adhesive II

v. preheating of hot melt adhesive

hot melt adhesive should be preheated before use. When preheating, pour the solid hot-melt adhesive into the preheating glue pot, heat it with a temperature of about 160 ℃ ~ 200 ℃, and preheat it for about 1 ~ 2 hours. When the heating temperature is reached and there is a deviation in the weight at both ends of the self-2 and driven needle: after adjusting the fluidity with good weight at both ends, put the preheated hot-melt adhesive into the glue groove on the machine with a temperature of 160 ℃ ~ 180 ℃, and then it can be used normally. The heating temperature of hot melt adhesive is closely related to the fluidity and bonding strength of the adhesive. Therefore, when heating hot melt adhesive, the temperature should be strictly controlled. The heating temperature should not be too high or too low, and the temperature range should be strictly controlled within the technical parameters provided by the manufacturer. Generally, the heating temperature and gluing temperature of hot melt adhesive should be controlled within the range of 170 ℃ ~ 180 ℃. If the temperature is too high, the fluidity is very good, and the permeability to the page is also strong, but the bonding strength will decline; When the temperature is too low, the bonding strength increases, but the fluidity of the adhesive decreases, which will make the pages unable to bond firmly, resulting in the quality problems of degumming and scattering. If the temperature of hot melt adhesive exceeds 200 ℃, it will cause carbonization and cracking of hot melt adhesive. The hot melt adhesive should not be stored for a long time. Try to avoid repeated melting and solidification

VI. gluing on the back and both sides of the back of the book block

the gluing part is the back and both sides of the back of the book block. After the back of the book block is milled and slotted, the hot-melt adhesive can be bonded between the pages of the book, and between the book block and the cover to form a book. The adhesive is different from the side adhesive. Their fluidity, opening time and curing time are different. The temperature of the adhesive should be controlled at 170 ℃ ~ 180 ℃, and the thickness of the adhesive on the adhesive should be generally controlled between 0.6 ~ 2mm. The adhesive layer should be uniform. The thinner the adhesive will affect the bonding strength, and the thicker the adhesive will increase the cost. The length of the back glue should be slightly shorter than the cover size of 1 ~ 2mm. Too long will cause residual glue to stick to the mechanical transmission parts and cause them to fail. Too short will cause empty backs and feet, affecting the quality. When applying the side glue between the book block and the cover, the side glue must be a hot melt adhesive with good fluidity, long opening time and curing time, strong bonding and high layer height. The temperature of the side glue is controlled at about 160 ℃ ~ 180 ℃, and the width of the upper side glue is generally about 4 ~ 6mm. The thinner the side glue, the better, and it is required to be firmly bonded, so as to ensure the quality of books and the requirements of cutting. Do not use back glue as side glue, otherwise it will make the lines on the cover of the book cover, affecting the quality of the product

VII. Causes and troubleshooting of common faults in binding and bookbinding

1 Book degumming and loose pages

(1) the back milling depth of the book block is not enough, and the pages are not completely milled into a single page, causing the book to not degumming and loose pages, the sharp back depth should be increased. (2) Improper slotting distance and insufficient slotting depth cause Book degumming and loose pages. The distance and depth between slotting knives should be adjusted; (3) If the temperature of the hot melt adhesive is too low and the fluidity and permeability of the adhesive liquid are poor, resulting in Book degumming and scattering, the hot melt adhesive should be heated to about 170 ℃ ~ 180 ℃. (4) If the glue on the back of the book is too thin, causing the book to degumm and scatter, the thickness of the back glue should be controlled, generally between 0.6 ~ 2mm. (5) If the improper use of hot-melt adhesive model causes Book degumming and scattering, the hot-melt adhesive with matching guide type and season should be selected

2. The back of the book is not square

(1) use a sharp back milling knife to mill the back, which causes the back of the book to be square, and you should replace the sharp back milling knife; (2) Uneven gluing of the back glue causes the back of the book to be uneven. The gluing mechanism should be adjusted to make the upper limbs of the back glue uniform; (3) If the back of the book is not square due to improper supporting and shaping mechanism, the supporting and shaping mechanism should be adjusted

(4) if the back of the book is not square due to uneven bookbinding, it should be well sorted to ensure the appearance quality of bookbinding

3. The cover is uneven and the carrying line of the cover is obvious

(1) the amount of side glue is up to Wen, resulting in uneven cover and obvious carrying line of the cover, so the coating amount of side glue should be controlled; (2) The humidity of side glue is too low, which causes uneven side glue coating, uneven cover and obvious shoulder line on the cover. The temperature of side glue should be increased, which is generally controlled at about 160 ℃ ~ 180 ℃

4. The cutting size of books is not accurate with the development of new energy vehicles and the passage of time

the cutting size of books is not accurate, and the size rules of the three side book cutter knife should be adjusted

in short, as long as we constantly explore and sum up experience from practice, carefully understand the properties of materials, master appropriate process parameters, and strictly operate the process, we can obtain satisfactory binding products

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